CMP, also referred to as thermal oxidation sharpening, utilizes MP together with chemical compounds to reinforce the MRR and increase surface good quality [20]. Determine two illustrates the schematic of an average CMP process [21]. The SiC wafer, which can be mounted about the carrier, and also the sprucing pad https://www.quora.com/profile/Trevor-Flatcher-2/Advantages-of-Silicon-Carbide-Materials-in-High-Temperature-Electronic-Devices-Silicon-carbide-SiC-has-emerged-as-a-c