The global 3D/2.5D TSV Interconnect Advanced Packaging Market is projected to reach USD 11.29 billion by 2034, growing at a CAGR of 12.16% from 2025 to 2034. This growth is driven by the increasing demand for high-performance, miniaturized electronic devices across various industries. https://www.marketresearchfuture.com/reports/3d-25d-tsv-interconnect-advanced-packaging-market-31944